Embedded Files
BOC
BOC
Substrate : CCL/PPG
• Stable dimension change
• Low Dk(under 3.5@1Ghz)
• Uniform Thickness
• Good reliability
FC CSP POP
FC CSP POP
Substrate : CCL/PPG
• Low CTE
• Customize for Tg
• Reverse CCL for coreless ETS process
• Good reliability
High Frequency
High Frequency
Substrate : CCL/PPG
• Low Dk/Df for 5G&DDR5
• Reverse CCL for coreless ETS process
• Good reliability
DAF/BGT/EMF
DAF/BGT/EMF
Temporary Tape
Temporary Tape
• Thermally conductive option
• High reliability
• Void free
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